Broadcom's VDSL2 Chipsets Power ZyXEL's IP DSLAM

Broadcom's VDSL2 Chipsets Power ZyXEL's IP DSLAM and CPE Equipment for Chunghwa Telecom's Next Generation Network

Broadcom(R) VDSL2 Chipsets for Central Office and Customer Premises Equipment Solutions Selected by ZyXEL and Chunghwa Telecom of Taiwan for Deployment in Next Generation IP Services Network

BERLIN, Oct. 10 /PRNewswire-FirstCall/ -- Broadband World Forum 2007 -- Broadcom Corporation , a global leader in semiconductors for wired and wireless communications, today announced that its VDSL2 and StrataXGS(R) Ethernet products have been qualified and selected by Chunghwa Telecom (CHT) of Taiwan for mass deployment in its next generation IP services network. Broadcom's powerful VDSL2 chipsets were originally selected by ZyXEL Corporation for incorporation in the ZyXEL VES-1600 and IES-5005 next generation access products. As a result of this successful engagement, Broadcom and ZyXEL have teamed together to provide VDSL2 IP DSLAM and customer premises equipment (CPE) products to Chunghwa Telecom for its next generation VDSL2 access network.

The selection by CHT provides decisive market validation of the Broadcom(R) VDSL2 technology and the ongoing collaboration between Broadcom and ZyXEL to develop best-in-class, standards-based solutions for Ethernet aggregation, ITU G.992.1/3/5 ADSL1/2/2+ and ITU G.993.2 VDSL2 access markets. The Chunghwa Telecom VDSL2 award adds to Broadcom's market leading position in ADSL2+/VDSL2 and Ethernet carrier access solutions.

Broadcom silicon and software bring unparalleled, standards-based solutions to the industry, addressing all aspects of sophisticated digital subscriber line (DSL)-based services with Wi-Fi(R), VoIP, Ethernet switching, multimedia over coaxial cable (MoCA) and video enabling features including its newly released PhyR(TM) impulse noise protection technology. ZyXEL will supply customer premises equipment including VDSL2 bridges, routers, wireless gateways and VoIP-enabled integrated access devices (IADs) based on Broadcom VDSL2, 10/100 Fast Ethernet switching, 802.11b/g and VoIP chipsets. Broadcom's unique integration of key VDSL2, local area network and VoIP technologies provides an unprecedented blend of performance and accelerated time-to-market across a complete CPE product portfolio.

"In the past, we have worked together with Broadcom to win ADSL DSLAM and Gigabit Ethernet switching contracts from worldwide telecom operators," says Dr. Yuh-Long Chen, President of ZyXEL. "It's truly a pleasure for us to work with Broadcom to win the CHT VDSL2 NGN project. To date, in terms of deployment scale and product specifications, this is the largest and most complex project of its kind in the world. Based on previous successful and extensive overseas VDSL2 deployments, ZyXEL is equipped to duplicate this success in establishing CHT's NGN network and to accelerate MOD and high definition VOD applications in the market. "

"Broadcom's third major win, the NGN deployment with CHT, is an outstanding example of our success in adding industry leading VDSL2 solutions to our broadly deployed and leading ADSL2+ position," said Greg Fischer, Vice President and General Manager of Broadcom's Carrier Access line of business. "CHT requires its vendors to meet a very high performance standard and is a showcase for advanced networks. Our performance, flexibility and competitiveness allow us to support ZyXEL in meeting the demanding requirements set forth by Chunghwa Telecom, a substantial achievement by both engineering teams to provide best-in-class solutions to our mutual customer."

About Broadcom

Broadcom Corporation is a major technology innovator and global leader in semiconductors for wired and wireless communications. Broadcom products enable the delivery of voice, video, data and multimedia to and throughout the home, the office and the mobile environment. We provide the industry's broadest portfolio of state-of-the-art, system-on-a-chip and software solutions to manufacturers of computing and networking equipment, digital entertainment and broadband access products, and mobile devices. These solutions support our core mission: Connecting everything(R).

Broadcom is one of the world's largest fabless semiconductor companies, with 2006 revenue of $3.67 billion, and holds over 2,200 U.S. and 900 foreign patents, more than 6,600 additional pending patent applications, and one of the broadest intellectual property portfolios addressing both wired and wireless transmission of voice, video and data. Broadcom is headquartered in Irvine, Calif., and has offices and research facilities in North America, Asia and Europe. Broadcom may be contacted at +1.949.926.5000 or at http://www.broadcom.com.

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All statements included or incorporated by reference in this release, other than statements or characterizations of historical fact, are forward-looking statements. These forward-looking statements are based on our current expectations, estimates and projections about our industry and business, management's beliefs, and certain assumptions made by us, all of which are subject to change. Forward-looking statements can often be identified by words such as "anticipates," "expects," "intends," "plans," "predicts," "believes," "seeks," "estimates," "may," "will," "should," "would," "could," "potential," "continue," "ongoing," similar expressions, and variations or negatives of these words. These forward-looking statements are not guarantees of future results and are subject to risks, uncertainties and assumptions that could cause our actual results to differ materially and adversely from those expressed in any forward-looking statement.

Important factors that may cause such a difference for Broadcom in connection with VDSL2 chipset and StrataXGS(R) products include, but are not limited to, general economic and political conditions and specific conditions in the markets we address, including the volatility in the technology sector and semiconductor industry, trends in the broadband communications markets in various geographic regions, including seasonality in sales of consumer products into which our products are incorporated, and possible disruption in commercial activities related to terrorist activity or armed conflict in the United States and other locations; the rate at which our present and future customers and end-users adopt Broadcom's technologies and products in the markets for central office and customer premise equipment applications; delays in the adoption and acceptance of industry standards in those markets; the timing, rescheduling or cancellation of significant customer orders and our ability, as well as the ability of our customers, to manage inventory; the gain or loss of a key customer, design win or order; our ability to scale our operations in response to changes in demand for our existing products and services or demand for new products requested by our customers; our ability to specify, develop or acquire, complete, introduce, market and transition to volume production new products and technologies in a cost-effective and timely manner; intellectual property disputes and customer indemnification claims and other types of litigation risk; the quality of our products and any remediation costs; changes in our product or customer mix; the volume of our product sales and pricing concessions on volume sales; the effectiveness of our expense and product cost control and reduction efforts; our ability to timely and accurately predict market requirements and evolving industry standards and to identify opportunities in new markets; problems or delays that we may face in shifting our products to smaller geometry process technologies and in achieving higher levels of design integration; our ability to retain, recruit and hire key executives, technical personnel and other employees in the positions and numbers, with the experience and capabilities, and at the compensation levels needed to implement our business and product plans; the risks and uncertainties associated with our international operations; competitive pressures and other factors such as the qualification, availability and pricing of competing products and technologies and the resulting effects on sales and pricing of our products; the timing of customer-industry qualification and certification of our products and the risks of non-qualification or non-certification; the availability and pricing of third party semiconductor foundry, assembly and test capacity and raw materials; fluctuations in the manufacturing yields of our third party semiconductor foundries and other problems or delays in the fabrication, assembly, testing or delivery of our products; the risks of producing products with new suppliers and at new fabrication and assembly facilities; the effects of natural disasters, public health emergencies, international conflicts and other events beyond our control; the level of orders received that can be shipped in a fiscal quarter; and other factors.

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